The Dimensity 9000 is a flagship challenger for Qualcomm, and now MediaTek has introduced its high-end counterparts, the Dimensity 8000 and 8100. Both processors are 5 nm devices with essentially the same circuitry. The 8100, on the other hand, is a silicon lottery winner and runs at higher clock speeds. There’s also the Dimensity 1300, which is a minor upgrade above the 1200 chip.
The two 8000 chips have four huge Cortex-A78 CPU cores and four little A55 CPU cores. The GPU is an ARM Mali-G610 MC6, which employs the company’s most recent GPU architecture. In comparison to the 8000, the Dimensity 8100 will have a 20% higher GPU frequency. In GFXBench Manhattan (offscreen), the 8100 achieved 170 frames per second, while the 8000 achieved 140.
Both processors include the MiraVision 780, which supports a 168 Hz refresh rate at FHD+ resolution and a 168 Hz refresh rate. The 8100 chip differs in that it also supports 120Hz at WQHD+. Both feature 4K AV1 video decoders as well as HDR10+ Adaptive (which adapts HDR10+ content to changing lighting conditions).
The Imagiq 780 ISP can record HDR video from two cameras at the same time at 5 gigapixels per second, as well as 4K 60 fps HDR10+ recording with one camera. This ISP supports cameras with up to 200 MP sensors, 2x lossless zoom, AI-powered noise reduction, and HDR shooting natively.
Both chipsets include 5G modems (3GPP Release 16) with two carrier aggregations for a total bandwidth of up to 200 MHz. This enables download speeds of up to 4.7 Gbps. Dual SIM, Dual Standby mode is supported by the modem. Locally, Wi-Fi
6E (2×2), Bluetooth 5.3, and Bluetooth LE Audio with Dual-Link True Wireless Stereo Audio are all supported locally. Support for BeiDou’s new B1C frequency is included in the positioning.
|Dimensity 1200||Dimensity 8000||Dimensity 8100||Dimensity 9000|
|Node||6 nm||5 nm||5 nm||4 nm|
|CPU (big)||1x Cortex-A78 @ 3.0 GHz||–||–||1x Cortex-X2 @ 3.05 GHz|
|CPU (medium)||3x Cortex-A78 @ 2.6 GHz||4x Cortex-A78 @ 2.75 GHz||4x Cortex-A78 @ 2.85 GHz||3x Cortex-A710 @ 2.85 GHz|
|CPU (small)||4x Cortex-A55 @ 2.0 GHz||4x Cortex-A55 @ 2.0 GHz||4x Cortex-A55 @ 2.0 GHz||4x Cortex-A510 @ 1.8 GHz|
|RAM||LPDDR4X (up to 4,266 Mbps)||LPDDR5 (up to 6,400 Mbps)||LPDDR5 (up to 6,400 Mbps)||LPDDR5X (up to 7,500 Mbps)|
|Storage||UFS 3.1||UFS 3.1||UFS 3.1||UFS 3.1|
|GPU||Mali-G77 MC9||Mali-G610 MC6||Mali-G610 MC6 (20% faster than 8000)||Mali-G710 MC10|
|Display||FHD+ @ 168 Hz||FHD+ @ 168 Hz||FHD+ @ 168 Hz, WQHD+ @ 120 Hz||FHD+ @ 180 Hz, WQHD+ @ 144 Hz|
|Camera (stills)||200 MP||200 MP (5 Gpixel/s IPS)||200 MP (5 Gpixel/s IPS)||320 MP (9 Gpixel/s IPS)|
|Camera (video)||4K @ 60 fps||4K @ 60 fps (HDR10+), dual recording||4K @ 60 fps (HDR10+), dual recording||4K @ 60 fps (HDR10+), triple recording|
|5G||4.7 Gbps downlink, 2.5 Gbps uplink||4.7 Gbps downlink||4.7 Gbps downlink||7 Gbps downlink, 2.5 Gbps uplink|
|Wi-Fi||Wi-Fi 6 (2×2)||Wi-Fi 6E (2×2)||Wi-Fi 6E (2×2)||Wi-Fi 6E (2×2)|
The only difference between the Dimensity 1300 and 1200 is the enhanced NPU performance, which provides more number-crunching power for night mode and HDR processing with AI.
Smartphones with a density of 1300, 8000, or 8100 chipsets will be available in the first quarter of 2022, so expect a flurry of announcements in March from “some of the world’s largest smartphone manufacturers.”