The Dimensity 8100 and Dimensity 8000 chipsets were presented by MediaTek at MWC 2022. A number of Chinese smartphone manufacturers, including Redmi, Realme, Vivo, and OnePlus, are believed to be working on Dimensity 8100-powered devices. Xu Qi, CMO of Realme China, announced today that the next Realme GT Neo3 will be powered by the Dimensity 8100 SoC.
“Realme will be the first to carry the Dimensity 8100 chip,” reads the machine-translated text of Xu Qi’s Weibo post, implying that the GT Neo3 will be the world’s first smartphone powered by the D8100 chip. The 5nm chip includes 4 Cortex-A78 CPU cores running at 2.85GHz, 4 Cortex-A55 CPU cores, Mali G-610 MC6 GPU, LPPDR5, UFS 3.1 storage, sub-6GHz 5G, Wi-Fi 6E, Bluetooth 5.3, and a 200MP camera.
The Realme GT Neo3 will also support 150W UltraDart charging. The D8100 is reported to be on par with the Snapdragon 888 in terms of performance. As a result, the GT Neo3 is expected to deliver an exceptional gaming experience.
The GT Neo3 will be available in two battery configurations. A 4,500mAh dual-cell battery is expected to be included in the variant that supports 150W UltraDart charging. A 5,000mAh dual-cell battery is believed to be included in the other option, which is intended to support 80W rapid charging. Other specifications are expected to be the same on both versions.
The phone will have a 6.7-inch OLED display with a center punch-hole, with a Full HD+ resolution and a 120Hz refresh rate. The phone will have up to 12 GB of RAM and 256 GB of native storage.
A 16-megapixel front camera and a 50-megapixel (primary, with OIS) + 8-megapixel + 2-megapixel triple camera unit will be included for photography. Other features include a Realme UI 3.0-based Android 12 OS and an in-display fingerprint scanner.