Chipset genealogy can be a quirky hobby, but sometimes new chips require a bit of digging. Enter MediaTek’s Dimensity 6400, which arrives as a modest update to last year’s 6300, itself a small upgrade over the 6100+ from 2023. However, the chip’s origins stretch even further back.
Built on TSMC’s 6nm process, the Dimensity 6400 features an octa-core CPU: 2x Cortex-A76 at 2.5GHz and 6x Cortex-A55 at 2.0GHz, along with an ARM Mali-G57 MC2 GPU. It supports LPDDR4X RAM (up to 2,133MHz) and UFS 2.2 storage, with display support up to 1080p+ at 120Hz and 10-bit colors. The ISP handles cameras up to 108MP, though video resolution details remain unclear. The 5G Release 16 modem offers a peak downlink speed of 3.3Gbps, while Wi-Fi 5 (ac) and Bluetooth 5.2 are also supported.
Comparing the Dimensity 6300, 6400, and Helio G100:
| Feature | Dimensity 6300 | Dimensity 6400 | Helio G100 |
|---|---|---|---|
| Node | TSMC 6nm | TSMC 6nm | TSMC 6nm |
| CPU (big) | 2x Cortex-A76 @ 2.4GHz | 2x Cortex-A76 @ 2.5GHz | 2x Cortex-A76 @ 2.2GHz |
| CPU (small) | 6x Cortex-A55 @ 2.0GHz | 6x Cortex-A55 @ 2.0GHz | 6x Cortex-A55 @ 2.0GHz |
| GPU | Mali-G57 MC2 | Mali-G57 MC2 | Mali-G57 MC2 |
| RAM | LPDDR4X 2,133MHz | LPDDR4X 2,133MHz | LPDDR4X |
| Storage | UFS 2.2 | UFS 2.2 | UFS 2.2 |
| Display | 1080p @ 120Hz | 1080p @ 120Hz | 1080p @ 120Hz |
| Camera | 108MP | 108MP | 200MP |
| Modem | 5G, 3.3Gbps | 5G, 3.3Gbps | 4G |
| Wi-Fi | 5 (ac) | 5 (ac) | 5 (ac) |
| Bluetooth | 5.2 | 5.2 | 5.2 |
| GNSS | dual-band | dual-band | dual-band |
In essence, the Dimensity 6400 is a slightly overclocked Dimensity 6300, with a 0.1GHz bump on the A76 cores. It shares much of its architecture with older chips like the Dimensity 810 from 2021, though the 6400 offers improvements like better 5G speeds and support for higher-resolution cameras. Despite its age, the Dimensity 6400 will power new devices, such as the upcoming Realme P3x 5G.
