This year at CES 2022, AMD unveiled its new Ryzen 6000 CPUs, which feature AMD’s improved Zen 3 Plus architecture, a new 6nm production node, and the company’s RDNA 2 graphics architecture for its integrated GPUs. Up to 1.3 times quicker processing, up to two times the gaming capabilities of the previous generation, and up to 24 hours of battery life are all promised by AMD.
The new laptop processors follow in the footsteps of the Ryzen 5000 family, which was revealed at CES 2021 last year. The Ryzen 6000 processors will be available in two series: an H-series line (with 35W and 45W models of each chip) for more powerful gaming and creative devices, and a 15W to 28W U-series line for thin-and-light laptops, similar to those models.
It has eight cores, 16 threads, a base clock speed of 3.3GHz, and a boosted maximum speed of 5.0GHz, as well as 12 GPU cores with a maximum boost speed of 2.4GHz, making it the lineup’s flagship. AMD adds that the 5.0GHz maximum boosted clock speed there marks the “fastest Ryzen product” ever — on both mobile and desktop (which is technically accurate from a raw frequency perspective, given that the Ryzen 9 5950X for desktop from 2020 maxed out at a 4.9GHz clock speed) (which is technically true from a raw frequency perspective, given that the Ryzen 9 5950X for desktop from 2020 maxed out at a 4.9GHz clock speed).
The introduction of AMD’s RDNA 2 graphics architecture for the Ryzen 6000 series’ integrated graphics — which is used on next-generation gaming products like AMD’s RX 6000-series GPUs, the Xbox Series X / S, and the PlayStation 5 — is also a huge boost for the company’s laptops, which had previously used the older Vega architecture.
According to AMD, the Ryzen 6000 series offers up to twice the graphics performance compared to Ryzen 5000 chips, with hardware ray tracing integrated into and a 50 percent bigger GPU compute engine. This is before AMD’s FidelityFX Super Resolution supersampling, which is also built into the new CPUs and allows for “fully playable AAA gaming on an ultrathin” notebook, is factored in.
With up to 73 fps on Deathloop and up to 114fps on Call of Duty: Vanguard using the super-sampling approach, AMD’s benchmarks notably highlight its U-series CPUs (which are more likely to be found on a laptop without a discrete GPU).
While the new Ryzen 6000 chips still use the Zen 3 architecture, AMD has made significant enhancements, particularly in power management, which allows for a maximum of 24 hours of battery life, thanks to inherent gains from the lower 6nm production node (up from 21 hours on 2021 models).
Lastly, there’s the deluge of new hardware standards that the Ryzen 6000 series will support: USB4 with data transfer rates at up to 40Gbps, PCIe Gen 4, DDR5 at up to 4,800 MT/s and LPDDR5 at up to 6,400 MT/s, HDMI 2.1 with support for high frame rates and VRR, Wi-Fi 6E, and Bluetooth LE 5.2. However, it will be left to device manufacturers to provide the hardware required to take advantage of that support.
The first laptops powered by AMD’s new Ryzen 6000 CPUs are already expected to be introduced at CES 2022 from firms like Acer, Asus, Alienware, Lenovo, Razer, and HP. For 2022, AMD anticipates over 200 “luxury” Ryzen 6000 laptops to be available, with the first units shipping in February.
The Intel 12th-gen H for laptops is its fastest chip yet
Intel claims “the fastest mobile processor”, ever.
Ahead of CES 2022, Intel unveiled its latest 12th Gen Alder Lake chip, which has the company’s new hybrid architecture and is led by the Core i9-12900HK, which Intel boldly claims is “the fastest mobile processor” ever.
One of Intel’s biggest achievements in recent years was its first wave of 12th Gen Alder Lake desktop chips last fall, allowing the company to deliver a CPU that could compete with AMD’s Ryzen 9 5950X flagship in productivity and gaming.
And now, Intel is introducing the same revolutionary approach to chip design—with its Arm-esque performance and efficiency cores—to laptops, starting with its most powerful 45W H-series versions of CPUs.
That performance gain is significant. The 12th-generation i9-12900HK is up to 44 percent faster in PugetBench and up to 30 percent faster in Blender, according to Intel’s own data.
On both tests, the Intel CPU outperformed AMD’s Ryzen R9 5900HX and Apple’s M1 Max.
INTEL 12TH GEN ALDER LAKE H-SERIES CHIPS
|Model||Cores (performance / efficiency)||Threads||Max turbo frequency||L3 cache||Processor base power|
|i9-12900HK||14 (6P / 8E)||20||5.0GHz||24MB||45W|
|i9-12900H||14 (6P / 8E)||20||5.0GHz||24MB||45W|
|i7-12800H||14 (6P / 8E)||20||4.8GHz||24MB||45W|
|i7-12700H||14 (6P / 8E)||20||4.7GHz||24MB||45W|
|i7-12650H||10 (6P / 4E)||16||4.7GHz||24MB||45W|
|i5-12600H||12 (4P / 8E)||16||4.5GHz||18MB||45W|
|i5-12500H||12 (4P / 8E)||16||4.5GHz||18MB||45W|
|i5-12450H||8 (4P / 4E)||12||4.4GHz||12MB||45W|
Intel also announced the future 12th-gen CPUs that will come to thin and light laptops later in Q1. Two performance and eight efficiency cores will be added to U processors for thinner laptops, while up to six performance and eight efficiency cores will be added to the P line for more powerful thin-and-light laptops.
In Q1, Intel’s 12th-generation H laptop CPUs will be available in devices.
Snapdragon 8cx Gen 3 is the first 5nm chipset for Windows
The new chip will power Windows-on-ARM laptops.
Qualcomm is concentrating its efforts on other platforms at the moment. Starting with Windows-on-ARM laptops and two new chipsets for them, one for high-end devices and the other for low-cost devices that nevertheless require 5G connectivity.
The high-end model is the Snapdragon 8cx Gen 3. We don’t know what CPU cores are employed here because Qualcomm is keeping hardware details under wraps. We do know it’s a 5 nm chipset (a first for Windows devices), although the original 8cx and the Gen 2 were both 7 nm parts.
According to the company, the new chip will have an 85% increase in multi-core performance and a 60% rise in GPU performance over its predecessor. The NPU has also been improved, now offering over 29 TOPS, which is three times more than the prior chip.
Qualcomm claims that this can be used in fanless systems because of the low power consumption. The prior chips might be able to do so as well, but in terms of long-term performance, this one should be a clear winner. The manufacturer also claims that the laptop would last for several days on a single charge, but this will certainly vary depending on the model.
Many of the innovations made in smartphone chips, such as improved modems, are tapped into by the 8cx Gen 3. When it comes to 5G, Qualcomm will offer laptop OEMs various options: the X65 modem, which can supply up to 10 Gbps downlink speeds, the older X55, which can deliver up to 7.5 Gbps, and the X62, which can deliver up to 4.4 Gbps downlink speeds. Local connectivity includes Wi-Fi 6 and the newest Wi-Fi 6E.
Qualcomm claims that this may be used in fanless designs because of the low power consumption. The prior chips might be able to do so as well, but in terms of long-term performance, this one should be a clear winner. The manufacturer also claims that the laptop would last for several days on a single charge, but this will certainly vary depending on the model.
Many of the innovations made in smartphone chips, such as improved modems, are tapped into by the 8cx Gen 3. When it comes to 5G, Qualcomm will offer laptop OEMs various options: the X65 modem, which can supply up to 10 Gbps downlink speeds, the older X55, which can deliver up to 7.5 Gbps, and the X62, which can deliver up to 4.4 Gbps downlink speeds. Wi-Fi 6 and Wi-Fi 6E are two options for local connectivity.
Other options include AI-assisted echo cancellation and noise reduction (this is where that beefy NPU comes into play). Furthermore, the chip enables numerous cameras; for example, it can simultaneously share front and back cameras for an online presentation at a workplace or at school. Working from home or studying while on the go is a big factor for this age.
The Snapdragon 7c+ Gen 3 is aimed at Windows laptops that aren’t too expensive. It’s made on a 6 nm process (the 7c Gen 2 was made on an 8 nm process) and has a 60% faster CPU and 70 % quicker GPU than its predecessor. Qualcomm didn’t directly compare the 8cx and 7c+, of course. The NPU has 6.5 TOPS of AI computation capacity, which is a little increase (up from 5 TOPS).
Wireless connectivity has also received a significant upgrade, with 5G now being supported. It can achieve downlink speeds of up to 3.7 Gbps thanks to its X53 modem. Wi-Fi 6E is also supported, with up to 2.9 Gbps rates.
The Snapdragon 8cx Gen 3 is the first 5nm chipset for Windows-on-ARM laptops, whereas the Snapdragon 7c+ Gen 3 is the successor to the Snapdragon 8cx Gen 2.
Even though the Snapdragon 7c Gen 2 only supported 4G, Qualcomm felt it was necessary to provide fast, modern connectivity to even the most basic laptops, so it switched to a 5G modem. Of course, the two new CPUs benefit from Snapdragon audio and security advancements.
The Snapdragon 8cx Gen 3 is the first 5nm chipset for Windows-on-ARM laptops, whereas the Snapdragon 7c+ Gen 3 is the successor to the Snapdragon 8cx Gen 2. The first Windows 11 laptops featuring Snapdragon 8cx Gen 3 and 7c+ Gen 3 processors will be available in the first half of 2022, according to Qualcomm.
MediaTek and AMD announce RZ600 series Wi-Fi 6E chips
The chipset will power next-generation AMD Ryzen-series laptops and desktop PCs.
Today, MediaTek and AMD announced a partnership to co-engineer industry-leading Wi-Fi solutions, beginning with the AMD RZ600 Series Wi-Fi 6E modules, which include MediaTek’s new Filogic 330P chipset. In 2022 and beyond, the Filogic 330P chipset will power next-generation AMD Ryzen-series laptops and desktop PCs, delivering fast Wi-Fi speeds with low latency and less interference from other signals.
AMD and MediaTek developed and certified PCIe® and USB interfaces for modern sleep states and power management, which are critical elements of modern customer experiences, to optimize the AMD RZ600 Series Wi-Fi 6E modules with a focus on delivering seamless connectivity experiences for customers. Furthermore, the optimization process included stress testing and ensuring compatibility standards, which may reduce development time for OEM customers in the long run.
Filogic 330P supports 2×2 Wi-Fi 6 (2.4/5GHz) and 6E (6GHz band up to 7.125GHz) connectivity standards, as well as Bluetooth® 5.2 (BT/BLE). The high throughput chipset is extremely fast, with up to 2.4Gbps connectivity and support for the new 6GHz spectrum at 160MHz channel bandwidth. The Filogic 330P chipset also incorporates MediaTek’s power amplifier (PA) and low noise amplifier (LNA) technology to help optimize power consumption and reduce design footprint, allowing it to be embedded in laptops of all sizes.
AMD RZ600 Series Wi-Fi 6E Modules Specifications
|Wi-Fi Module||Wi-Fi Specs||M.2 Slots|
|AMD RZ616 Wi-Fi 6E module||Wi-Fi 6E 2x2160MHz Wi-Fi ChannelsPHY rate up to 2.4Gbps||M.2 2230 and 1216|
|AMD RZ608 Wi-Fi 6E module||Wi-Fi 6E 2x280MHz Wi-Fi ChannelsPHY rate up to 1.2Gbps||M.2 2230|
The AMD RZ600 Series Wi-Fi 6E modules extend AMD’s Wi-Fi capabilities, providing excellent connectivity solutions to OEMs and end-users whether they are playing the latest interactive games, working remotely, or completing a large project.
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