Today, MediaTek and AMD announced a partnership to co-engineer industry-leading Wi-Fi solutions, beginning with the AMD RZ600 Series Wi-Fi 6E modules, which include MediaTek’s new Filogic 330P chipset. In 2022 and beyond, the Filogic 330P chipset will power next-generation AMD Ryzen-series laptops and desktop PCs, delivering fast Wi-Fi speeds with low latency and less interference from other signals.
AMD and MediaTek developed and certified PCIe® and USB interfaces for modern sleep states and power management, which are critical elements of modern customer experiences, to optimize the AMD RZ600 Series Wi-Fi 6E modules with a focus on delivering seamless connectivity experiences for customers. Furthermore, the optimization process included stress testing and ensuring compatibility standards, which may reduce development time for OEM customers in the long run.
Filogic 330P supports 2×2 Wi-Fi 6 (2.4/5GHz) and 6E (6GHz band up to 7.125GHz) connectivity standards, as well as Bluetooth® 5.2 (BT/BLE). The high throughput chipset is extremely fast, with up to 2.4Gbps connectivity and support for the new 6GHz spectrum at 160MHz channel bandwidth. The Filogic 330P chipset also incorporates MediaTek’s power amplifier (PA) and low noise amplifier (LNA) technology to help optimize power consumption and reduce design footprint, allowing it to be embedded in laptops of all sizes.
AMD RZ600 Series Wi-Fi 6E Modules Specifications
|Wi-Fi Module||Wi-Fi Specs||M.2 Slots|
|AMD RZ616 Wi-Fi 6E module||Wi-Fi 6E 2x2160MHz Wi-Fi ChannelsPHY rate up to 2.4Gbps||M.2 2230 and 1216|
|AMD RZ608 Wi-Fi 6E module||Wi-Fi 6E 2x280MHz Wi-Fi ChannelsPHY rate up to 1.2Gbps||M.2 2230|
The AMD RZ600 Series Wi-Fi 6E modules extend AMD’s Wi-Fi capabilities, providing excellent connectivity solutions to OEMs and end-users whether they are playing the latest interactive games, working remotely, or completing a large project.